Professor Madhavan Swaminathan

Madhavan Swaminathan

John Pippin Chair in Electromagnetics
School of Electrical and Computer Engineering
Georgia Institute of Technology
Office: Klaus 1358
Phone: 404.894.3340 | Fax: 404.894.9959
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Madhavan Swaminathan received his B.E. degree in Electronics and Communication from the University of Madras and his M.S. and Ph.D. degrees in Electrical Engineering from Syracuse University. He is currently a Professor in the School of Electrical and Computer Engineering, Georgia Tech and the Deputy Director of the Packaging Research Center, Georgia Tech. He is the founder of Jacket Micro Devices, a company specializing in integrated devices and modules for wireless applications where he serves as the Chief Scientist. Prior to joining Georgia Tech, he was with the Advanced Packaging Laboratory at IBM working on packaging for super computers.

Professor Swaminathan has over 250 publications in refereed journals and conferences, has co-authored 3 book chapters, has 11 issued patents and has 6 patents pending. While at IBM, he reached the second invention plateau. He served as the Co-Chair for the 1998 and 1999 IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), served as the Technical and General Chair for the IMAPS Next Generation IC & Package Design Workshop, serves as the Chair of TC-12, the Technical Committee on Electrical Design, Modeling and Simulation within the IEEE CPMT society and was the Co-Chair for the 2001 IEEE Future Directions in IC and Package Design Workshop. He is the co-founder of the IMAPS Next Generation IC & Package Design Workshop and the IEEE Future Directions in IC and Package Design Workshop. He also serves on the technical program committees of EPEP, Signal Propagation on Interconnects workshop, Solid State Devices and Materials Conference (SSDM), Electronic Components and Technology Conference (ECTC), and International Symposium on Quality Electronic Design (ISQED).

Research Interests

  • Numerical methods in electromagnetics
  • Interconnect design and analysis
  • Power Distribution for GHz Systems
  • Time domain characterization methods
  • IC-Package Co-design

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