Vanessa Smet
Research Engineer II
Program Manager Interconnections and Assembly
3D Systems Packaging Research Center
School of Electrical and Computer Engineering
Georgia Institute of Technology
Office: MaRC 355
Phone: 404.385.0511| Fax: 404.894.3842
E-mail: vanessa.smet@prc.gatech.edu
Dr. Vanesssa Smet oversees the Interconnections & Assembly Program for the 3D Systems Packaging Research Center at Georgia Tech.
Her research spans the areas of power electronics, power integration, high temperature die-attachment, 3d packaging technologies, µbga, thermo-mechanical modeling, finite element analysis, reliability of electronic systems, power & thermal cycling, failure analysis, mechanical engineering, mechanics of micro-scale materials, multi-physics problems, and lead-free solders.
Education:
M.S. Electrical and Electronics Engineering - Université Montpellier 2, 2007
Ph.D. Electronics - Université Montpellier 2, 2010
Research Interests
- Power Electronics
- Power Integration
- 3D Packaging Technologies
- Thermo-Mechanical Modeling
- Reliability of Electronic Systems
- Failure Analysis
- Mechanics of Micro-Scale Materials
