Dr. Vanessa Smet

Vanessa Smet

Research Engineer II
Program Manager Interconnections and Assembly

3D Systems Packaging Research Center
School of Electrical and Computer Engineering
Georgia Institute of Technology
Office: MaRC 355
Phone: 404.385.0511| Fax: 404.894.3842
E-mail: vanessa.smet@prc.gatech.edu

Dr. Vanesssa Smet oversees the Interconnections & Assembly Program for the 3D Systems Packaging Research Center at Georgia Tech.

Her research spans the areas of power electronics, power integration, high temperature die-attachment, 3d packaging technologies, µbga, thermo-mechanical modeling, finite element analysis, reliability of electronic systems, power & thermal cycling, failure analysis, mechanical engineering, mechanics of micro-scale materials, multi-physics problems, and lead-free solders.


B.S. Applied Physics - Université Paris Sud (Paris XI), 2004

M.S. Electrical and Electronics Engineering - Université Montpellier 2, 2007

Ph.D. Electronics - Université Montpellier 2, 2010

Research Interests

  • Power Electronics
  • Power Integration
  • 3D Packaging Technologies
  • Thermo-Mechanical Modeling
  • Reliability of Electronic Systems
  • Failure Analysis
  • Mechanics of Micro-Scale Materials

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